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关键词:汽车电子 电池管理系统(BMS) e200z7 MCU

时间:2018-08-03 11:34:54       作者:NXP       来源:中电网

nxp公司的MPC5775B和MPC5775E MCU是用于汽车和逆变器的电池管理系统(BMS),提供先进的性能,安全性和支持ASIL-D.具有2个Power Architecture z7内核,MPC5775E频率高达264 MHz,MPC5775B 频率高达220 MHz,1个z7内核与其中一个主内核同步,集成了 4 MB闪存,512 KB SRAM以及CSE硬件安全模块,支持SHE协议规范和AES-128加密,具有10/100Mbps以太网模块和2个CAN-FD 模块和4个FlexCAN模块,高达70通道eQADC和32通道eMIOS,主要用在需要先进性能,安全性和ASIL-D支持的汽车和工业电池管理和逆变器应用.本文介绍了MPC5775B和MPC5775E主要特性,MPC5775E框图以及评估板MCU主板和子板MPC5775BE-416DS主要特性,功能框图,MPC5775BE-416DS子板电路图.

The MPC5775B and MPC5775E microcontrollers target automotive and industrial battery management and inverter applications that require advanced performance, security, and ASIL-D support.

These MCUs are compatible with the MPC5777C device and offer customers an optimized feature set for the targeted applications. The MPC5775B and MPC5775E provide an ideal migration path for customers using MPC5xx, MPC55xx, MPC5644A and MPC5674F with eTPU timer and similar pin count options.

MPC5775BE主要特性:

• Three dual issue,32-bit CPU core complexes(e200z7),two of which run in lockstep
• Power Architecture embedded specification compliance
• Instruction set enhancement allowing variable length encoding (VLE), optionalencoding of mixed 16-bit and 32-bit instructions, for code size footprintreduction
• On the two computational cores: Signal processing extension (SPE1.1)instruction support for digital signal processing (DSP)
• Single-precision floating point operations
• On the two computational cores: 16 KB I-Cache and 16 KB D-Cache
• Hardware cache coherency between cores
• 16 hardware semaphores
• 3-channel CRC module
• 4 MB on-chip flash memory
• Supports read during program and erase operations, and multiple blocksallowing EEPROM emulation
• 512 KB on-chip general-purpose SRAM including 64 KB standby RAM
• Two multichannel direct memory access controllers (eDMA)
• 64 channels per eDMA
• Dual core Interrupt Controller (INTC)
• Dual phase-locked loops (PLLs) with stable clock domain for peripherals andfrequency modulation (FM) domain for computational shell
• Crossbar Switch architecture for concurrent access to peripherals, flash memory, orRAM from multiple bus masters with End-To-End ECC
• System Integration Unit (SIU)
• Error Injection Module (EIM) and Error Reporting Module (ERM)
• Four protected port output (PPO) pins
• Boot Assist Module (BAM) supports serial bootload via CAN or SCI
• Up to three second-generation Enhanced Time Processor Units (eTPUs)
• 32 channels per eTPU
• Total of 36 KB code RAM
• Total of 9 KB parameter RAM
• Enhanced Modular Input/Output System (eMIOS) supporting 32 unified channels
with each channel capable of single action, double action, pulse width modulation(PWM) and modulus counter operation
• Up to two Enhanced Queued Analog-to-Digital Converter (eQADC) modules with:
• Two separate analog converters per eQADC module
• Support for a total of 70 analog input pins, expandable to 182 inputs with offchipmultiplexers
• Up to four independent 16-bit Sigma-Delta ADCs (SDADCs)
• Ethernet (FEC)
• Two SENT Receiver (SRX) modules supporting 12 channels
• Five Deserial Serial Peripheral Interface (DSPI) modules
• Five Enhanced Serial Communication Interface (eSCI) modules
• Four Controller Area Network (FlexCAN) modules
• Two M_CAN modules that support FD
• Fault Collection and Control Unit (FCCU)
• Clock Monitor Units (CMUs)
• Tamper Detection Module (TDM)
• Cryptographic Services Engine (CSE)
• Complies with Secure Hardware Extension (SHE) Functional SpecificationVersion 1.1 security functions
• Includes software selectable enhancement to key usage flag for MACverification and increase in number of memory slots for security keys
• PASS module to support security features
• Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with somesupport for 2010 standard
• Device and board test support per Joint Test Action Group (JTAG) IEEE 1149.1 and 1149.7
• On-chip voltage regulator controller (VRC) that derives the core logic supply voltagefrom the high-voltage supply
• On-chip voltage regulator for flash memory
• Self Test capability

图1.MPC5775E框图

评估板MPC5775BE-416DS

This user guide details the setup and configuration of the NXPMPC5775BE Evaluation Board (hereafter referred to as theEVB). The EVB is intended to provide a mechanism for easycustomer evaluation of the MPC5775B/E family ofmicroprocessors, and to facilitate hardware and softwaredevelopment.

For the latest product information, please speak to your NXPrepresentative or consult the MPC57xx website atwww.nxp.com The EVB is intended for bench or laboratory use and has beendesigned using normal temperature specified components(+70℃).

For maximum flexibility and simplicity, the EVB has beendesigned as a modular development platform. The EVB mainboard does not contain an MCU. Instead, the MCU is fitted toan MCU daughter card (occasionally referred to as an adapterboard). This approach means that the same EVB platform canbe used for multiple packages and MCU derivatives within theMPC57xx family. High density connectors provide theinterface between the EVB and MCU daughter cards as shownin Figure2.

图2.模块概念-主板(MB)和MCU子板

主板(MB)主要特性:

• Support provided for different MPC57xx MCUs by utilizing MCU daughter cards
• Single 12 V external power supply input with four on-board regulators providing all of the necessary EVB and MCUvoltages; power supplied to the EVB via a 2.1mm barrel style power jack or a 2-way level connector; 12 V operationallows in-car use if desired
• Master power switch and regulator status LEDs
The Mother Board provides the following key features:
• Support provided for different MPC57xx MCUs by utilizing MCU daughter cards
• Single 12 V external power supply input with four on-board regulators providing all of the necessary EVB and MCUvoltages; power supplied to the EVB via a 2.1mm barrel style power jack or a 2-way level connector; 12 V operationallows in-car use if desired
• Master power switch and regulator status LEDs

MCU子板主要特性:

• MCU (soldered or through a socket)
• 40 MHz onboard clock oscillator circuit in EVB for MCU Clocking
• User reset switch with reset status LEDs and Power Indication LEDs
• Standard 14-pin JTAG debug connector and 50-pin SAMTEC Nexus connector
• USB (Type B)/UART transceiver to interface with MCU
• Liberal scattering of ground and test points (surface mount loops) placed throughout the EVB
• Power SBC for standalone function of Daughter Card
• One CAN and one LIN connector supported by Power SBC

图3. MPC5775BE-416DS适配板外形图

图4.MPC5775B和MPC5775E汽车应用示意图

图5.主板功能框图

图6. MPC5775BE-416DS子板功能框图

图7. MPC5775BE-416DS子板电路图(1)

图8. MPC5775BE-416DS子板电路图(2)

图9. MPC5775BE-416DS子板电路图(3)

图10. MPC5775BE-416DS子板电路图(4)

图11. MPC5775BE-416DS子板电路图(5)

图12. MPC5775BE-416DS子板电路图(6)

图13. MPC5775BE-416DS子板电路图(7)
详情请见:
https://www.nxp.com/docs/en/data-sheet/MPC5775E_DS.pdf
https://www.nxp.com/docs/en/user-guide/MPC5775BEEVBUG.pdf
以及https://www.nxp.com/downloads/en/schematics/SPF-32229.pdf
MPC5775E_DS.pdf
MPC5775BEEVBUG.pdf
SPF-32229.pdf
MPC5775BE-416DS-BOM.xls

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