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关键词:ARM Cortex-R5F MCU ARM Cortex-A53 工厂自动化 工业新葡京娱乐平台 PLC

时间:2018-11-06 11:14:30       作者:ARM       来源:中电网

TI公司的AM6548是具有TSN使能的用于工业4.0 工业级Sitara处理器,提供先进工业通信,增强安全性,高度可靠性和安全特性.处理器组合两个四个或两个ARM Cortex-A53和和两个Cortex-R5F MCU子系统, 四核Arm® Cortex®-A53 MCU工作频率高达1.1GHz,双核Arm Cortex-R5F MCU工作频率高达400MHz,具有三个吉比特工业通信子系统(PRU_ICSSG),两个10/100/1000以太网端口per PRU_ICSSG,支持两个SGMII端口,和10/100Mb PRU-ICSS兼容,有24x PWM per PRU_ICSSG,可以逐个周期控制,主要用在工业可编控制器(PLC),带安全功能的工厂自动化,多协议现场总线通信,工业PC,工业新葡京娱乐平台,人机接口,电网基础设备保护继电器和新葡京娱乐平台马达驱动器.本文介绍了AM654x和AM652x主要特性,功能框图,以及TMDX654GPEVM AM65x 评估模块(EVM)系统外形图和处理器板电路图,材料清单和PCB设计图.

AM654x and AM652x Sitara Arm applications processors are built to meet the complex processing needs of modern industrial embedded products.

The AM654x and AM652x devices combine four or two Arm Cortex-A53 cores with a dual Cortex-R5F MCU subsystem which includes features intended to help customers achieve their functional safety goals for their end products and three Gigabit industrial communications subsystems (PRU_ICSSG) to create a SoC capable of high-performance industrial controls with industrial connectivity and processing for functional safety applications. AM65xx is currently undergoing assessment to be certified by TÜV SÜD

according to IEC 61508.

The four A53 cores are arranged in two dual-core clusters with shared L2 memory to create two processing channels. Extensive ECC is included on on-chip memory, peripherals, and interconnect for reliability. The SoC as a whole includes features intended to help customers design systems that can achieve their functional safety goals (assessment pending with TÜV SÜD). Cryptographic acceleration and secure boot are available on AM654x and AM652x devices in addition to granular firewalls managed by the DMSC.

Programmability is provided by the quad-core Arm Cortex-A53 RISC CPUs with Neon extension, and the dual Cortex-R5F MCU subsystem is available for general purpose use as two cores or it can be used in lockstep to help meet the needs of functional safety applications. The PRU_ICSSG subsystems can be used to provide up to six ports of industrial Ethernet such as Profinet IRT, TSN, or EtherCAT™ (among many others), or they can be used for standard Gigabit Ethernet connectivity.

TI provides a complete set of software and development tools for the Arm cores including Processor SDK Linux-RT, RTOS, and Android as well as C compilers and a debugging interface for visibility into source code execution. Applicable safety documentation will be made available to assist customers in developing their functional safety related systems.

AM654x和AM652x主要特性:

1Processor Cores:

• Quad-Core Arm® Cortex®-A53 Microprocessor Subsystem at up to 1.1 GHz

– Two Dual-Core Cortex-A53 Clusters with 512KB L2 Cache Including SECDED

– Each A53 Core has 32KB L1 ICache and 32K L1 DCache

• Dual-Core Arm Cortex-R5F at up to 400 MHz

– Supports Lockstep Mode

– 16KB ICache, 16KB DCache, and 64KB RAM per R5F Core

Industrial Subsystem:

• Three Gigabit Industrial Communication Subsystems (PRU_ICSSG)

– Two 10/100/1000 Ethernet Ports per PRU_ICSSG

– Supports Two SGMII Ports (2)

– Compatibility with 10/100Mb PRU-ICSS

– 24× PWMs per PRU_ICSSG

– Cycle-by-Cycle Control

– Enhanced Trip Control

– 18× Sigma-Delta Filters per PRU_ICSSG

– Short Circuit Logic

– Over-Current Logic

– 6× Multi-protocol Position Encoder Interfaces per PRU_ICSSG

Memory Subsystem:

• Up to 2MB of On-Chip L3 RAM with SECDED

• Multi-Core Shared Memory Controller (MSMC)

– Up to 2MB (2 banks × 1MB) SRAM with SECDED

– Shared Coherent Level 2 or Level 3 Memory-Mapped SRAM

– Shared Coherent Level 3 Cache

– 256-Bit Processor Port Bus and 40-Bit Physical Address Bus

– Coherent Unified Bi-Directional Interfaces to Connect to Processors or Device Masters

– L2, L3 Cache Pre-Warming and Post Flushing

– Bandwidth Management with Starvation Bound

– One Infrastructure Master Interface

– Single External Memory Master Interface

– Supports Distributed Virtual System

– Supports Internal DMA Engine – DRU (Data Routing Unit)

– ECC Error Protection

• DDR Subsystem (DDRSS)

– Supports DDR3L/DDR4 Memory Types up to DDR-1600

– Supports LPDDR4 Memory Type up to DDR-1333

– 32-Bit Data Bus and 7-Bit SECDED Bus

– 32GB of Total Addressable Space

• General-Purpose Memory Controller (GPMC)

Safety:

• AM65xx Helps System Designers Address Safety Requirements

– The Dual Cortex-R5F System is Undergoing Assessment to be Certified at TÜV SÜD

According to IEC 61508, Targeting SIL-3

– The A53 Cores and Entire System on Chip (SoC) is Undergoing Assessment to be Certified at TÜV SÜD According to IEC 61508, Targeting SIL-2

– ECC or Parity on Calculation-Critical Memories

– ECC and Parity on Internal Bus Interconnect

– Firewalls to Help Provide Freedom From Interference (FFI)

– Built-In Self-Test (BIST) for CPU, High-End Timers, and On-Chip RAM

– Hardware Error Injection Support for Test-for- Diagnostics

– Error Signaling Modules (ESM) for Capture of Safety Related Errors

– Voltage, Temperature, and Clock Monitoring

– Windowed and Non-Windowed Watchdog Timers in Multiple Clock Domains

• MCU Island

– Isolation of the Dual-Core Arm Cortex-R5F Microprocessor Subsystem to Help Provide

Freedom From Interference (FFI)

– Separate Voltage, Clocks, Resets, and Dedicated Peripherals

– Internal MCSPI Connection to the Rest of SoC

Security:

• Secure Boot Supported

– Hardware-Enforced Root-of-Trust

– Support to Switch Root-of-Trust via Backup Key

– Support for Takeover Protection, IP Protection, and Anti-Roll Back Protection

• Cryptographic Acceleration Supported

– Session-Aware Cryptographic Engine with Ability to Auto-Switch Key-Material Based on

Incoming Data Stream

– Supports Cryptographic Cores

– AES – 128/192/256 Bits Key Sizes

– 3DES – 56/112/168 Bits Key Sizes

– MD5, SHA1

– SHA2 – 224/256/384/512

– DRBG with True Random Number Generator

– PKA (Public Key Accelerator) to Assist in RSA/ECC Processing

– DMA Support

• Debugging Security

– Secure Software Controlled Debug Access

– Security Aware Debugging

• Trusted Execution Environment (TEE) Supported

– Arm TrustZone® Based TEE

– Extensive Firewall Support for Isolation

– Secure DMA Path and Interconnect

– Secure Watchdog/Timer/IPC

• Secure Storage Support

• On-the-Fly Encryption and Authentication Support for OSPI Interface

• Networking Security Support for Data (Payload) Encryption/Authentication via Packet Based Hardware Cryptographic Engine

• Security Co-Processor (DMSC) for Key and Security Management, with Dedicated Device Level Interconnect for Security

SoC Services:

• Device Management Security Controller (DMSC)

– Centralized SoC System Controller

– Manages System Services Including Initial Boot, Security, Safety and Clock/Reset/Power Management

– Power Management Controller for Active and Low Power Modes

– Communication with Various Processing Units over Message Manager

– Simplified Interface for Optimizing Unused Peripherals

– Tracing and Debugging Capability

• Sixteen 32-Bit General-Purpose Timers

• Two Data Movement and Control Navigator Subsystems (NAVSS)

– Ring Accelerator (RA)

– Unified DMA (UDMA)

– Up to 2 Timer Managers (TM) (1024 Timers Each)

Multimedia:

• Display Subsystem

– Two Fully Input-Mapped Overlay Managers Associated with Two Display Outputs

– One Port MIPI® DPI Parallel Interface

– One Port OLDI

• Graphics Processing Unit (GPU)

• One Camera Serial Interface-2 (MIPI CSI-2)

• One Port Video Capture: BT.656/1120 (No Embedded Sync)

High-Speed Interfaces:

• One Gigabit Ethernet (CPSW) Interface Supporting

– RMII (10/100) or RGMII (10/100/1000)

– IEEE1588 (2008 Annex D, Annex E, Annex F) with 802.1AS PTP

– Audio/Video Bridging (P802.1Qav/D6.0)

– Energy-Efficient Ethernet (802.3az)

– Jumbo Frames (2024 bytes)

– Clause 45 MDIO PHY Management

• Two PCI-Express® Revision 3.1 Subsystems (2)

– Supports Gen3 (8.0GT/s) Operation

– Two Independent 1-lane, or a Single 2-lane Port

– Support for Concurrent Root-Complex and/or End-Point Operation

• USB 3.1 Dual-Role Device Subsystem (2)

– One Enhanced SuperSpeed Gen1 Port

– One USB 2.0 Port

– Each Port Independently Configurable as USB Host, USB Peripheral, or USB Dual-Role Device

General Connectivity:

• 6× Inter-Integrated Circuit (I2C) Ports

• 5× Configurable UART/IrDA/CIR Modules

• Two Simultaneous Flash Interfaces Configured

– Two OSPI™ Flash Interfaces

– or Hyperbus™ and OSPI1 Flash Interface

• 2× 12-Bit Analog-to-Digital Converters (ADC)

– Up to 4 Msamples/s

– Eight Multiplexed Analog Inputs

• 8× Multichannel Serial Peripheral Interfaces (MCSPI) Controllers

– Two with Internal Connections

– Six with External Interfaces

• General-Purpose I/O (GPIO) Pins

Control Interfaces:

• 6× Enhanced High Resolution Pulse-Width Modulator (EHRPWM) Modules

• One Enhanced Capture (eCAP) Module

• 3× Enhanced Quadrature Encoder Pulse (eQEP) Modules

Automotive Interfaces:

• 2× Modular Controller Area Network (MCAN) Modules with Full CAN-FD Support

Audio Interfaces:

• 3× Multichannel Audio Serial Port (MCASP) Modules

Media and Data Storage:

• 2× MultiMedia Card/Secure Digital (MMC/SD) Interfaces

Simplified Power Management:

• Simplified Power Sequence with Full Support for Dual Voltage I/O

• Integrated LDOs Reduces Power Solution Complexity

• Integrated SDIO LDO for Handling Automatic Voltage Transition for SD Interface

• Integrated POR (Power on Reset) Generation Reducing Power Solution Complexity

• Integrated Voltage Supervisor for Safety Monitoring

• Integrated Power Supply Glitch Detector for Detecting Fast Power Supply Transients

Analog/System Integration:

• Integrated USB VBUS Detection

• Fail Safe I/O for DDR RESET

• All I/O Pins Drivers Disabled During Reset to Avoid Bus Conflicts

• Default I/O Pulls Disabled During Reset to Avoid System Conflicts

• Support Dynamic I/O Pinmux Configuration Change

System on Chip (SoC) Architecture:

• Supports Primary Boot from UART, I2C, MCSPI, HyperBus, Parallel NOR Flash, SD or eMMC, USB, PCIe, and Ethernet Interfaces

• 28-nm CMOS Technology

• 23 mm × 23 mm, 0.8-mm Pitch, 784-Pin S-PBGA (ACD)

AM654x和AM652x应用:

• Industrial Programmable Controllers (PLC)

• Factory Automation with Safety Functions

• Multi-Protocol Fieldbus Communications

• Industrial PC

• Industrial Robots

• Human Machine Interface (HMI)

• Grid Infrastructure Protection Relays

• Robotic Motor Drives

图1. AM654x和AM652x功能框图

The AM65x GP EVM is a standalone test, development, and evaluation module (EVM) system that lets developers write software and develop hardware for industrial communication-type applications. The GP EVM is equipped with AM6548 processor from TI and a defined set of features to let the user experience industrial communication solutions using serial, Ethernet-based, PCIe, and many other interfaces. Using standard interfaces, the GP EVM can communicate with other processors or systems, and act as a

communication gateway. In addition, the GP EVM can directly operate as a standard remote I/O system or simple sensor connected to an industrial communication network. The embedded emulation logic allows for emulation and debugging using standard development tools such as Code Composer Studio™, from TI, by using the supplied USB cable.

The AM65x GP EVM is a high performance, standalone development platform that enables users to evaluate and develop industrial applications for the Texas Instrument’s K3 System-on-Chip (SoC). The AM65x GP EVM supports the following key features:

• Based on the K3 architecture with Arm

• 4-GB DDR4 supporting data rate up to 1600 MT/s

• 16-GB eMMC Flash

• Full size SD card, up to 64-GB density with UHS-1 support (8-GB UHS-1 card supplied with the kit)

• 128-Mbit SPI EEPROM

• 512-Mbit OSPI EEPROM

• 256-Kbit I2C Boot EEPROM

• 3× PRU-ICSSG, supporting multi-protocol industrial Gigabit Ethernet on 2 ports

• Expansion Connectors with two full PRU-ICSSG ports

• 1x MCU Gigabit Ethernet port

• One USB2.0 interface port with Micro AB connector

• CSI-2 connector to interface camera card

• I-PEX EVAFLEX5-VS connector to interface with the LCD adapter card

• GPMC/DSS interface expansion connector

• Application board expansion connector

• SERDES expansion connector to interface two lane PCIe Personality card

• XDS110 on-board emulator

• Quad port UART to USB circuit over microB USB connector

• Expansion headers:

– Two UART

– One SPI

– One I2C

– Four timer signals

• Boot mode selection using DIP switches

• Two push buttons to generate interrupts

• Industrial Ethernet LEDs

• DC Input: 11 V to 28 V

• Status output: LEDs to indicate power status

• INA devices for current monitoring

• Over- and under-voltage protection circuit

• RoHS-compliant design

AM654x系列评估模块

The AM65x Evaluation Module provides a platform to quickly start evaluation of Sitara™ Arm® Cortex®-A53 AM65x Processors (AM6548, AM6546, AM6528, AM6527, AM6526) and accelerate development for HMI, networking, patient monitoring, and other industrial applications. It is a development platform based on the quad core Cortex-A53, dual Cortex-R5F processor that is integrated with ample connectivity such as PCIe, USB 3.0/2.0, Gigabit Ethernet, and more.

AM654x系列评估模块主要特性:

3 gigabit Ethernet ports

4GB DDR4 with ECC

On-board 16GB eMMC

On-board 512Mb OSPI Flash

1-lane PCIe Gen3.1, USB 3.1, USB 2.0 and CSI-2 interfaces

AM654x系列评估模块包括: 

Assembled EVM

SD card

USB cable

Ethernet cable

Documentation

图2. TMDX654GPEVM AM65x 评估模块(EVM)系统外形图

图3. TMDX654GPEVM AM65x 评估模块(EVM)系统架构接口图

图4.处理器板外形图(顶视图)

图5.处理器板外形图(底视图)

处理器板主要特性:

SoC:

• Based on the K3 architecture with Quad-Core Arm® Cortex®-A53 Microprocessor and Dual-Core Arm

Cortex-R5F Arm

• Heatsink and support for 12-V fan

Memory:

• 4-GB DDR4 supporting data rate up to 1600 MT/s

• 16-GB eMMC Flash which can support HS400 speed of operation

• Full size SD card, up to 64-GB density with UHS-1 support

• 128-Mbit SPI EEPROM

• 512-Mbit OSPI EEPROM

• 256-Kbit I2C EEPROM for Boot

I/O Interface:

• One MCU Gigabit Ethernet port and two Industrial Ethernet ports based on the Gigabit Industrial Communication Subsystem (PRU-ICSS-Gb) paired with Texas Instruments Gigabit Ethernet PHYs

• One USB2.0 interface with Micro AB connector

• CSI-2 connector to interface camera card

Expansion Bus:

• I-PEX EVAFLEX5-VS connector to interface with the LCD adapter card

• GPMC/DSS interface expansion connector for secondary display

• Application connector to expansion application cards

• SERDES expansion connector to support various SERDES modules

Debug:

• XDS110 on-board emulator

• Supports 20-pin JTAG connection from external emulator

• Automatic selection between on-board and external emulator (higher priority)

• Quad port UART to USB circuit over microB USB connector

• Two UART, one SPI, and I2C ports connected to test header for slave testing of the AM65x device

• Four timer signals from Maxwell connected to test header

• Two push buttons to generate Interrupts

Power Supply:

• Wide range DC input: 11 V to 28 V

• Status output: LEDs to indicate power status

• INA devices for current monitoring

• Over- and under-voltage protection circuit

Compliance:

• RoHS-compliant

• REACH-compliant

图6.处理器板功能框图

图7.处理器板电路图(1)

图8.处理器板电路图(2)

图9.处理器板电路图(3)

图10.处理器板电路图(4)

图11.处理器板电路图(5)

图12.处理器板电路图(6)

图13.处理器板电路图(7)

图14.处理器板电路图(8)

图15.处理器板电路图(9)

图16.处理器板电路图(10)

图17.处理器板电路图(11)

图18.处理器板电路图(12)

图19.处理器板电路图(13)

图20.处理器板电路图(14)

图21.处理器板电路图(15)

图22.处理器板电路图(16)

图23.处理器板电路图(17)

图24.处理器板电路图(18)

图25.处理器板电路图(19)

图26.处理器板电路图(20)

图27.处理器板电路图(21)

图28.处理器板电路图(22)

图29.处理器板电路图(23)

图30.处理器板电路图(24)

图31.处理器板电路图(25)

图32.处理器板电路图(26)

图33.处理器板电路图(27)

图34.处理器板电路图(28)

图35.处理器板电路图(29)

图36.处理器板电路图(30)

图37.处理器板电路图(31)

图38.处理器板电路图(32)

图39.处理器板电路图(33)

图40.处理器板电路图(34)

图41.处理器板电路图(35)

图42.处理器板电路图(36)

图43.处理器板电路图(37)

图44.处理器板电路图(38)

图45.处理器板电路图(39)

图46.处理器板电路图(40)

图47.处理器板电路图(41)

图48.处理器板电路图(42)

图49.处理器板PCB设计图(1)

图50.处理器板PCB设计图(2)

图51.处理器板PCB设计图(3)

图52.处理器板PCB设计图(4)

图53.处理器板PCB设计图(5)

图54.处理器板PCB设计图(6)

图55.处理器板PCB设计图(7)

图56.处理器板PCB设计图(8)

图57.处理器板PCB设计图(9)

图58.处理器板PCB设计图(10)

图59.处理器板PCB设计图(11)

图60.处理器板PCB设计图(12)

图61.处理器板PCB设计图(13)

图62.处理器板PCB设计图(14)

图63.处理器板PCB设计图(15)

图64.处理器板PCB设计图(16)

图65.处理器板PCB设计图(17)

图66.处理器板PCB设计图(18)

图67.处理器板PCB设计图(19)

图68.处理器板PCB设计图(20)

图69.处理器板PCB设计图(21)

图70.处理器板PCB设计图(22)

处理器板材料清单见:

详情请见:

http://www.ti.com/lit/ug/spruid7b/spruid7b.pdf 

http://www.ti.com/lit/ds/symlink/am6548.pdf 

以及

http://www.ti.com/lit/ml/sprw323a/sprw323a.pdf 

http://www.ti.com/lit/ug/spruim7/spruim7.pdf 

am6548.pdf
spruim7.pdf
sprw323a.pdf

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